Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer

Product Details
Customization: Available
After-sales Service: Lifetime After-Sales
Warranty: 1 Year
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Year of Establishment
2005-03-02
Management System Certification
ISO 9001
  • Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer
  • Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer
  • Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer
  • Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer
  • Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer
  • Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer
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Basic Info.

Model NO.
PEDB-10HD /20HD
Standard Modular Design
Standard Modular Design
Cooling System
Air Cooling
Applicable Material
Solar Engergy
Technical Class
Continuous Wave Laser
Type
Optical Fiber Laser
Command Language System
English
Engraving Machine Type
Laser Engraving Machine
Usage
Metal
Power
High Power
Drive Type
AC Servo Drive
Certification
ISO 9001, CE
Laser Type
Fiber Laser
Control
CNC
Current
AC
Condition
New
Transport Package
Export Sea-Worthy Packing or Air-Worthy Packing
Specification
ISO 9001 & CE
Trademark
Perfect Laser
Origin
China
HS Code
84609090
Production Capacity
3000 Sets/Year

Product Description

Perfect Laser-Laser Scribing Machine For Solar silicon wafer 

Contact:Candy 
 

Perfect Laser produced a new generation of laser scribing machine PE-20W / 50W mainly used for scribing and cutting metal and silicon, germanium, gallium arsenide and other semiconductor material substrate , machinable solar panels, ceramic , aluminum foil, etc.
This solar cell scribing machine adopts fiber laser as work light source. The two-dimensional work table is controlled by computer, and could do kinds of movement according to what graphics be input in. It has high output power, high precision scribing, fast speed and could cut curve and straight line graph

Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer
Model specification PE-20W/50W Laser Scribing Machine
Laser wavelength 1064nm
Laser power 20W
Scribing line width 50um
Scribing speed 240mm/s
Scribing precision ±10um
Workbench wide 200×200mm
Temperature control precision 0.5ºC
Working power supply 220V/50Hhz/1.5KVA
Workbench Cell automatic adsorption, dust removal
Cooling way High precision and constant temperature circulating water cooling professional integration Air cooling
     
Product Feature:
1. Software upgrade: the solar cell scribing machine supports the arc interpolation,circular arc cutting more smoothly.

2. The wafer laser scribing machine upgrade: covers an area of space smaller after modification, operating more accord with human body engineering.
3. Refactoring workbench processing part, open-type workbench processing area, up-down material more convenient. Removed spare parts from the workbench tablet, higher precision and not easy to deformation.
4. Improvement the screw parts of the wafer laser scribing machine: screw lead increased, so as to expedite the processing speed, guarantee machining accuracy.
5. Direct plug-in light path design, higher machining precision, the wafer laser scribing machine can receive better effect .
6. Serve motor modification of laser scribing solar cells machine: run more smoothly, smaller cutting noise,more humanized design;
7. Authoritarian flat dust removal device: the processing effect of the solar cell scribing machine is better.
8.Improved the laser signal control section, software runs more stable and fast.

Application:

This laser scribing machine is widely used in solar photovoltaic industry, monocrystalline silicon and polycrystalline silicon solar battery (cell) and silicon (wafer) of scribing processing (cutting section).
Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer

New design: Reconstruct the mechanical structure to make the device structure more compact, easier to use. Rewrite the part of the fiber laser scribing machine software source code to make software run more stable and faster.

High Configuration: Using 20W fiber laser, make the beam quality better (standard base model), kerf finer (30μm), and more smooth edge.

Free-maintenance: machine using standard modular design, the real free-maintenance uninterrupted continuous operation, without wasting replacement of wearing parts.

Easy operation: an integrated air-cooled device settings, device smaller, more simple operation.

Dedicated control software: specifically for laser scribing machine designed control software, easy to operate, can be displayed in real time dicing path.

High efficiency: T-station duplex alternating operation, improve work efficiency dicing maximum speed up to 200mm / s

Application and Market
? Able to adapt to silicon, polycrystalline silicon, amorphous silicon cells and dicing of silicon, germanium, gallium arsenide semiconductor material scribing and cutting.


Perfect Laser-Laser Scribing Machine for Solar Silicon Wafer


Contact me:
Perfect Laser Co., Ltd. (China)
Contact: Candy / Sales Department

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