Perfect Laser-Laser Scribing Machine For Solar silicon wafer
Perfect Laser produced a new generation of laser scribing machine PE-20W / 50W mainly used for scribing and cutting metal and silicon, germanium, gallium arsenide and other semiconductor material substrate , machinable solar panels, ceramic , aluminum foil, etc.
This solar cell scribing machine adopts fiber laser as work light source. The two-dimensional work table is controlled by computer, and could do kinds of movement according to what graphics be input in. It has high output power, high precision scribing, fast speed and could cut curve and straight line graph
|PE-20W/50W Laser Scribing Machine
|Scribing line width
|Temperature control precision
|Working power supply
|Cell automatic adsorption, dust removal
|High precision and constant temperature circulating water cooling professional integration
1. Software upgrade: the solar cell scribing machine supports the arc interpolation,circular arc cutting more smoothly.
2. The wafer laser scribing machine upgrade: covers an area of space smaller after modification, operating more accord with human body engineering.
3. Refactoring workbench processing part, open-type workbench processing area, up-down material more convenient. Removed spare parts from the workbench tablet, higher precision and not easy to deformation.
4. Improvement the screw parts of the wafer laser scribing machine: screw lead increased, so as to expedite the processing speed, guarantee machining accuracy.
5. Direct plug-in light path design, higher machining precision, the wafer laser scribing machine can receive better effect .
6. Serve motor modification of laser scribing solar cells machine: run more smoothly, smaller cutting noise,more humanized design;
7. Authoritarian flat dust removal device: the processing effect of the solar cell scribing machine is better.
8.Improved the laser signal control section, software runs more stable and fast.
This laser scribing machine is widely used in solar photovoltaic industry, monocrystalline silicon and polycrystalline silicon solar battery (cell) and silicon (wafer) of scribing processing (cutting section).
New design: Reconstruct the mechanical structure to make the device structure more compact, easier to use. Rewrite the part of the fiber laser scribing machine software source code to make software run more stable and faster.
High Configuration: Using 20W fiber laser, make the beam quality better (standard base model), kerf finer (30μm), and more smooth edge.
Free-maintenance: machine using standard modular design, the real free-maintenance uninterrupted continuous operation, without wasting replacement of wearing parts.
Easy operation: an integrated air-cooled device settings, device smaller, more simple operation.
Dedicated control software: specifically for laser scribing machine designed control software, easy to operate, can be displayed in real time dicing path.
High efficiency: T-station duplex alternating operation, improve work efficiency dicing maximum speed up to 200mm / s
Application and Market
? Able to adapt to silicon, polycrystalline silicon, amorphous silicon cells and dicing of silicon, germanium, gallium arsenide semiconductor material scribing and cutting.
Perfect Laser Co., Ltd. (China)
Contact: Candy / Sales Department