| Customization: | Available |
|---|---|
| Certification: | CE |
| Cutting Method: | Laser Cutting |
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The picosecond laser glass cutter can be used the following :
1. Reinforced and non-reinforced glass cutting, such as: mobile phone glass cover plate, car glass cover plate, camera glass cover plate.
2. Sapphire glass cutting, such as: mobile sapphire cover plate, camera sapphire glass cover plate, sapphire light strip LED light strip.
3. LCD glass cutting, such as: shaped LCD screen inverted R/U/C Angle, LCD screen cutting.
4.other optical glass cutting , such as: filter cutting, mirror cutting.
5. Ordinary glass cutting, such as high borosilicate glass, quartz glass, white glass, car mirrors,bathroom glass, etc.




Laser System |
Cutting system | Split system | |
| Laser light source | Picosecond infrared laser | CO2 laser | |
| Laser wavelength | 1060nm | 10.6um | |
| Average output power | 60W ( 30/60/80W optional ) |
120w (80w/100w/120w/ 150w optional) |
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| Pulse train energy | ≥ 1.2mj @50kHz | - | |
| Pulse Width | < 10ps | - | |
| Processing performance | Cutting speed | A adjustable from 0-500mm/s | |
| Cutting platform | The maximum processing area is 300 * 300mm; Adsorption fixture 350 * 350mm; XYZ motion platform effective travel 550 * 550 * 100mm Customizable |
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| Cutting head | Bessel | ||
| Cutting thickness | 0.1-20mm ( need to match different power lasers ) |
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| Positioning accuracy | ≤± 3um | ||
| Repeat positioning accuracy | ≤± 1um | ||
| Collapse | < 5um | ||
| CCD visual positioning system | 5 million CCD ,optional | ||
| Software System | Independently developed cutting and splitting processing system | ||
| Environmental conditions for use | Power supply specifications | 220V/50Hz , 8kW | |
| Cooling method | Water Cooling | ||
| Environmental requirements | 20-35ºC (install air conditioning, control the indoor temperature to be stable ±3 ºC) | ||
| Basic amplitude | 10-60Hz | ||
| Air pressure | 0.5-0.7Mpa | ||



