Hubei, China
Business Type:
Manufacturer/Factory & Trading Company
Year of Establishment:
2005-03-02
Management System Certification:
ISO 9001
Main Markets:
South America, Europe, Southeast Asia/ Mideast
Sample Available

Solar Cell Laser Cutting Machine, Solar Cell Laser Scribing Machine, Laser Wafer Scribing Machine manufacturer / supplier in China, offering Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free, Manual Sheet Metal Bending Machine Pel-100, CNC Sheet Metal Bending Machine for Aluminum and so on.

Diamond Member Since 2007
Audited Supplier

Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free

Get Latest Price
Min. Order / Reference FOB Price
1 Piece US $7,500-13,000/ Piece
Port: Shanghai, China
Production Capacity: 50000 Per Year
Payment Terms: L/C, T/T, Western Union, Paypal, Money Gram
Customized: Customized
Standard Modular Design: Standard Modular Design
Cooling System: Air Cooling
Applicable Material: Silicon Solar Cell
Technical Class: Pulse Laser
Type: Optical Fiber Laser

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Basic Info

Model NO.
PE-20W/50WII
Power
10W, 20W, 30W, 50W, 100W
Marking Area
Standard 200*200mm
Automatic
Yes
Lifetime
Over 10 Years
Consumables
No
Working Power Supply
220V/50hhz
Graphic Format
Ai, BMP, Dst, Dwg, Dxf, Dxp
Warranty
Laser Source Warranty 3 Years
Scribing Speed
240mm/S
Scribing Precision
10um
Trademark
Perfect Laser
Transport Package
Professional International Wood Craftcase
Specification
0.83*0.96*1.88m/ 0.53*0.48*0.63m
Origin
Hubei
HS Code
84561000
Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free
(Model: PE-20W/50WII)
Contact: Mandy
Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free
 



 
Product Description:
Perfect Laser launched the latest full-enclosed type fiber laser scribing and cutting machine with dust-proof cover PE-20W/50WII, the biggest difference between the first generation is that the machine is fully enclosed design, machine with dust cover, can avoid environmental pollution, to prevent the operator's vision damage. High output power, high precision scribing, fast speed and could cut curve and straight line graph.
Adopting Continuous pumping acousto-optic adjustable Q's Nd: YAG laser as work light source, The two-dimensional work table is controlled by computer,and could do kinds of movement according to what graphics be input in. Mainly used for metal and silicon, germanium, gallium arsenide and other semiconductor material substrate scribing and cutting, machinable solar panels, silicon, ceramic , aluminum foil, etc., the workpiece is fine and beautiful with smooth cutting edges.

Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free


Features:
1.This solar cell laser scribing machine is fully enclosed design, with dust cover, it can avoid environmental pollution, to prevent the operator's vision damage.

2.Software upgrade: the solar cell laser scribing machine support the arc interpolation,circular arc cutting more smoothly.

3.The wafer scribing machine upgrade: covers an area of space smaller after modification, operating more accord with human body engineering.

4.Refactoring workbench processing part, open-type workbench processing area, up-down material more convenient. Removed spare parts from the workbench tablet, higher precision and not easy to deformation.

5. Improvement the screw parts of solar cell laser scribing machine: screw lead increased, so as to expedite the processing speed, guarantee machining accuracy.

6. Direct plug-in light path design of the solar cell cutting machine, higher machining precision, better effect .

7.Serve motor modification: run more smoothly, smaller cutting noise,more humanized design;

8.Authoritarian flat dust removal device, The processing effect of the solar cell cutting machine is better.

9.Improved the laser signal control section of the solar cell cutting machine, software runs more stable and fast.

This laser scribe machine is widely used in solar photovoltaic industry, monocrystalline silicon and polycrystalline silicon solar battery (cell) and silicon (wafer) of scribing processing (cutting section).

Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free



Technical Data:
Model specification
 
PE-20W/50W(II) Laser Scribe Machine
 
Laser wavelength
 
1064nm
 
Laser power
 
20W
 
Scribing line width
 
50um
 
Scribing speed
 
240mm/s
 
Scribing precision
 
±10um
 
Workbench wide
 
200×200mm
 
Temperature control precision
 
0.5ºC
 
Working power supply
 
220V/50Hhz/1.5KVA
 
Workbench
 
Cell automatic adsorption, dust removal
 
Cooling way
 
High precision and constant temperature circulating water cooling professional integration
 
Air cooling

Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free



Services:
1> All of our machine will be full-checked by our quality control department before the shipment.
We make sure that customers will be get good products from us. and all of our machine with a12 
months quality guarantee period.
2> We will enclose an "Instruction Book", "Operation Manual" and "Training Video" (in English
version) to you, which is easily understood and handle by the customer.
3> We will offer plenty of online supports,  by email, video, telephone and fax. 
4> Our engineer can make a door-to-door instruction training service.
Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free


Perfect Laser Co., Ltd. (China)
Contact: Mandy / Sales Department
Add: HengRuichuangzhi Technology Park, No.13 YangQiaohu Road, Jiangxia District, Optical Village, Wuhan, Hubei, China(430200).
Tel: 0086-27-86791986  MP: 0086-13659885078   Fax: 0086-27-86775865       
Solar Cell Silicon Wafer Dicing Cutting Machine with Maintenance Free


 

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